面向强化装配界面接触热性能的导热特性异质化设计方法

王晨; 林起崟; 丘铭军; 洪军

doi:10.7652/xjtuxb202509007

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面向强化装配界面接触热性能的导热特性异质化设计方法

—————————————————————— | 更新时间：2025-09-11

- 面向强化装配界面接触热性能的导热特性异质化设计方法
- Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces
- 西安交通大学学报 2025年59卷第9期页码：65-76
- 作者机构：
  
  1.西安交通大学现代设计及转子轴承系统教育部重点实验室， 710049，西安
  2.西安交通大学机械工程学院， 710049，西安
  3.金属成形技术与重型装备全国重点实验室， 710018，西安
  4.中国重型机械研究院股份公司， 710018，西安
- 作者简介：
  
  王晨（1999—），男，博士生
  林起崟，男，教授，博士生导师。
- 基金信息：
  
  国家自然科学基金优秀青年科学基金项目(52222508);国家自然科学基金联合基金资助项目(U24B6006);国家自然科学基金重点项目(52335011)
- DOI：10.7652/xjtuxb202509007
  中图分类号： TH122
- 收稿：2025-03-05，
  
  网络首发：2025-04-27，
  
  纸质出版：2025-09-10
- 稿件说明：
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王晨, 林起崟, 丘铭军, 等. 面向强化装配界面接触热性能的导热特性异质化设计方法[J]. 西安交通大学学报, 2025,59(9):65-76.

WANG Chen, LIN Qiyin, QIU Mingjun, et al. Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces[J]. Journal of Xi’an Jiaotong University, 2025, 59(9): 65-76.
王晨, 林起崟, 丘铭军, 等. 面向强化装配界面接触热性能的导热特性异质化设计方法[J]. 西安交通大学学报, 2025,59(9):65-76. DOI： 10.7652/xjtuxb202509007.

WANG Chen, LIN Qiyin, QIU Mingjun, et al. Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces[J]. Journal of Xi’an Jiaotong University, 2025, 59(9): 65-76. DOI： 10.7652/xjtuxb202509007.

摘要

为解决装配界面接触热性能不足引起的散热性能和工作性能不足的问题，首先，构建了基于实测粗糙表面形貌的装配界面接触热性能数值分析模型；其次，测试了相应压力和温度工况下接触热阻以验证数值模型的准确性；最后，从装配界面微观接触传热机理出发，提出了装配界面导热特性异质化设计思路，建立了装配界面导热特性渐进迭代优化设计方法。结果表明：构建的装配界面接触热性能数值分析模型能够实现接触热性能的高精度预测，与实验结果对比，相对误差为15.52%；装配界面导热特性异质化设计通过提高界面温度梯度分布均匀性，有效降低接触热阻，优化设计后接触热性能提高23.12%。该研究为保障电子芯片封装、航天飞行器等热敏感复杂机械产品的接触热性能与整体散热性能提供了新的技术支撑。

Abstract

To address the inadequate heat dissipation and operational performance caused by insufficient contact thermal performance at assembly interfaces

this study first establishes a numerical analysis model for contact thermal performance based on measured rough surface topography of assembly interfaces. Subsequently

contact thermal resistance under corresponding pressure and temperature conditions is tested to verify the accuracy of the numerical model. Finally

starting from the microscopic heat transfer mechanism at the assembly interface

a heterogeneous design approach for thermal conductivity is proposed

establishing a progressive iterative optimization design method for the thermal conductivity of assembly interfaces. The results demonstrate that the constructed numerical analysis model for contact thermal performance can achieve high-precision predictions

with a relative error of 15.52%. The heterogeneous design of thermal conductivity effectively reduces contact thermal resistance by improving the uniformity of temperature gradient distribution at the interface

resulting in a 23.12% improvement in contact thermal performance after optimization. This study provides new technical support for ensuring the contact thermal performance and overall heat dissipation in thermally sensitive complex mechanical products

such as electronic chip packaging and aerospace vehicles.

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references

SHEKHAR S , BOGAERTS W , CHROSTOWSKI L , et al . Roadmapping the next generation of silicon photonics [J ] . Nature Communications , 2024 , 15 ( 1 ): 751 .

周意葱 , 林起崟 , 王晨 , 等 . 自适应参数驱动的装配界面形状主动设计方法 [J ] . 机械工程学报 , 2023 , 59 ( 5 ): 212 - 222 .

ZHOU Yicong , LIN Qiyin , WANG Chen , et al . Active design of assembly interface shape using self-adaptive parameters [J ] . Journal of Mechanical Engineering , 2023 , 59 ( 5 ): 212 - 222 .

WANG Chen , QIU Mingjun , PAN Zongkun , et al . Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package [J ] . Applied Thermal Engineering , 2025 , 259 : 124936 .

杨万奎 , 郭啸宇 , 曾和荣 , 等 . ODS MA754合金传热界面接触热阻实验研究 [J ] . 西安交通大学学报 , 2024 , 58 ( 2 ): 100 - 108 .

YANG Wankui , GUO Xiaoyu , ZENG Herong , et al . Experimental study on thermal contact resistance of heat transfer interface of ODS MA754 alloy [J ] . Journal of Xi'an Jiaotong University , 2024 , 58 ( 2 ): 100 - 108 .

SUN Lin , JIA Huiyin , LEI Xiaoyu , et al . Research on thermal contact resistance between C/C and resin thermal protection materials for solid rocket motor nozzles considering real surface roughness [J ] . Tribology International , 2023 , 186 : 108626 .

WANG Chen , LIN Qiyin , PAN Zongkun , et al . Thermal contact analysis of flip-chip package considering microscopic contacts of double-layer thermal interface materials [J ] . Applied Energy , 2024 , 356 : 122453 .

SUN Ducheng , YOU Ersheng , ZHANG Ting , et al . A review of thermal contact conductance research of conforming contact surfaces [J ] . International Communications in Heat and Mass Transfer , 2024 , 159 ( Part B ): 108065 .

PAN Xiaoshan , CUI Xiaoyu , LIU Shaoshuai , et al . Research progress of thermal contact resistance [J ] . Journal of Low Temperature Physics , 2020 , 201 ( 3 ): 213 - 253 .

孟庆宇 , 刘杨 , 鄢欣欣 , 等 . 基于分形理论的电主轴系统热态分布特性研究 [J ] . 机械工程学报 , 2021 , 57 ( 13 ): 63 - 69 .

MENG Qingyu , LIU Yang , YAN Xinxin , et al . Research on thermal distribution characteristics of motorized spindle system based on fractal theory [J ] . Journal of Mechanical Engineering , 2021 , 57 ( 13 ): 63 - 69 .

XIAN Yaoqi , ZHANG Ping , ZHAI Siping , et al . Re-estimation of thermal contact resistance considering near-field thermal radiation effect [J ] . Applied Thermal Engineering , 2019 , 157 : 113601 .

XIAN Yaoqi , ZHENG Zhiheng , ZHAI Siping , et al . The effects of roughness, temperature, and near-field thermal radiation on the thermal contact resistance between dissimilar materials Si, SiO 2 and SiC [J ] . ES Energy & Environment , 2023 , 19 : 823 .

REN Xingjie , DAI Yanjun , GOU Jianjun , et al . Numerical study on thermal contact resistance of 8-harness satin woven pierced composite [J ] . International Journal of Thermal Sciences , 2021 , 159 : 106584 .

GOU Jianjun , REN Xingjie , DAI Yanjun , et al . Study of thermal contact resistance of rough surfaces based on the practical topography [J ] . Computers & Fluids , 2018 , 164 : 2 - 11 .

DAI Yanjun , GOU Jianjun , REN Xingjie , et al . A test-validated prediction model of thermal contact resistance for Ti-6Al-4V alloy [J ] . Applied Energy , 2018 , 228 : 1601 - 1617 .

REN Xingjie , DAI Yanjun , GOU Jianjun , et al . Numerical prediction of thermal contact resistance of 3D C/C-SiC needled composites based on measured practical topography [J ] . International Journal of Heat and Mass Transfer , 2019 , 131 : 176 - 188 .

REN Xingjie , DING Hao , DAI Yanjun , et al . Experimental study on thermal contact resistance of carbon fiber reinforced silicon carbide composite with 3D needled preform (3DN C/SiC) [J ] . International Communications in Heat and Mass Transfer , 2021 , 124 : 105271 .

KOULALI A , ABDERRAHMANE A , JAMSHED W , et al . Comparative study on effects of thermal gradient direction on heat exchange between a pure fluid and a nanofluid: employing finite volume method [J ] . Coatings , 2021 , 11 ( 12 ): 1481 .

VALLEPUGA-ESPINOSAJ , UBERO-MARTÍNEZ I , RODRÍGUEZ-TEMBLEQUE L , et al . A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging [J ] . Engineering Analysis with Boundary Elements , 2020 , 115 : 28 - 39 .

宣益民 , 李强 , 张平 . 高温条件下的固-固界面接触热阻测试方法与系统 [J ] . 中国科学(技术科学) , 2019 , 49 ( 5 ): 491 - 500 .

XUAN Yimin , LI Qiang , ZHANG Ping . Measurement method and instrument of thermal contact resistance at high temperature [J ] . Scientia Sinica (Technologica) , 2019 , 49 ( 5 ): 491 - 500 .

CHEN Mengjun , LI Qiang , ZHANG Ping . Experimental investigation of high temperature thermal contact resistance of thin disk samples using infrared camera in vacuum condition [J ] . International Journal of Heat and Mass Transfer , 2020 , 157 : 119749 .

陈燕 , 樊光亚 , 林志辉 , 等 . 航空发动机法兰接触热阻特性实验研究 [J ] . 航空动力学报 , 2022 , 37 ( 4 ): 734 - 742 .

CHEN Yan , FAN Guangya , LIN Zhihui , et al . Experimental investigation on contact thermal resistance characteristics of aero-engine flange [J ] . Journal of Aerospace Power , 2022 , 37 ( 4 ): 734 - 742 .

TREGENZA O , SAHA M , HUTASOIT N , et al . An experimental evaluation of the thermal interface resistance between cold sprayed copper/laser-textured alumina bi-layered composites [J ] . International Journal of Heat and Mass Transfer , 2022 , 188 : 122606 .

DAI Wen , WANG Yandong , LI Maohua , et al . 2D materials-based thermal interface materials: structure, properties, and applications [J ] . Advanced Materials , 2024 , 36 ( 37 ): 2311335 .

WEI Baojie , LUO Wenmei , DU Jianying , et al . Thermal interface materials: from fundamental research to applications [J ] . SusMat , 2024 , 4 ( 6 ): e239 .

WANG Chen , LIN Qiyin , PAN Zongkun , et al . Optimization design method of material stiffness of contact interface considering surface roughness for improving thermal contact performance [J ] . International Communications in Heat and Mass Transfer , 2023 , 149 : 107131 .

WANG Chen , GU Feiyu , HONG Jun , et al . Analysis of internal and external factors affecting thermal contact resistance from the perspective of entransy dissipation [J ] . International Journal of Heat and Mass Transfer , 2025 , 238 : 126469 .

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