粗糙导体表面提取印刷电路板介质参数的微分外推方法

贾琦; 黄斌科

doi:10.7652/xjtuxb201508003

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粗糙导体表面提取印刷电路板介质参数的微分外推方法

更新时间：2025-07-09

- 粗糙导体表面提取印刷电路板介质参数的微分外推方法
- A Differential Extrapolation Method to Extract Dielectric Parameters of PCB with Roughened Conductor Surface
- 西安交通大学学报 2015年49卷第8期页码：11-16
- 作者机构：
  
  西安交通大学电子与信息工程学院,西安,710049
- 作者简介：
- 基金信息：
  
  : 2014-11-28。作者简介: 贾琦(1992—),女,硕士生;黄斌科(通信作者),男,副教授。基金项目: 国家自然科学基金资助项目(61471293)
- DOI：10.7652/xjtuxb201508003
  中图分类号： TN811.2
- 网络首发：2015-08-10，
  
  纸质出版：2015
- 稿件说明：
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贾琦, 黄斌科. 粗糙导体表面提取印刷电路板介质参数的微分外推方法[J]. 西安交通大学学报, 2015,49(8):11-16.

A Differential Extrapolation Method to Extract Dielectric Parameters of PCB with Roughened Conductor Surface[J]. 2015, 49(8): 11-16.
贾琦, 黄斌科. 粗糙导体表面提取印刷电路板介质参数的微分外推方法[J]. 西安交通大学学报, 2015,49(8):11-16. DOI： 10.7652/xjtuxb201508003.

A Differential Extrapolation Method to Extract Dielectric Parameters of PCB with Roughened Conductor Surface[J]. 2015, 49(8): 11-16. DOI： 10.7652/xjtuxb201508003.

摘要

针对在高速传输/互连结构中小尺寸印刷电路板(PCB)金属导带表面粗糙对信号传输损耗和相移影响增大的问题

提出了一种宽频带下提取PCB板介质参数的方法。该方法基于带状线模型

首先计算表面光滑导体和粗糙导体时的表面阻抗; 然后利用表面阻抗计算表面粗糙导体模型的传播常数; 最后借助微分外推方法分离光滑导体下的传播常数

从而在宽频带下提取介质基板的介电常数和损耗角正切。仿真结果表明:在从直流到20 GHz的频带上

分离导体表面粗糙影响后

提取的介电常数和损耗角正切与实际采用的聚四氟乙烯材料参数相比

在1 MHz下

相对介电常数误差为2%

损耗角正切为5%; 在10～20 GHz的高频范围内

相对介电常数最大误差为1%

损耗角正切最大误差为8.6%。该方法基于等效表面阻抗理论

在保证计算精度的同时

有效地节约了计算资源

适于在宽频带下提取PCB板的介质参数。

Abstract

A method to extract dielectric parameters of PCB board in a wide band is proposed to focus on the problem that rough conductor surfaces of small-scale printed circuit board in high-speed transmission/interconnection structures increase their impact on transmission loss and phase constant. Surface impedance for conductors with smooth surface and rough surface is respectively calculated based on a stripline model and then propagation constants of the stripline model with rough conductors are obtained. A differential extrapolation method is proposed to separate the dielectric loss from the total loss so that dielectric parameters such as permittivity and loss tangent are extracted in a wide frequency band. Simulation results from DC to 20 GHz with eliminating the effects of conductor surface roughness and comparisons with the actual FR4 material parameters show that the extracted permittivity and loss tangent have errors of 2% and 5% respectively at 1MHz and both the maximum errors reach to 1% and 8.6% respectively in a high frequency band from 10 GHz to 20 GHz. The proposed method is based on the equivalent surface impedance theory

and can save computing resources effectively without decreasing accuracy

and it is suitable for extracting dielectric parameters of PCB board in wide band.

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Keywords

references

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