多梁结构压阻式测振加速度传感器

刘岩; 赵玉龙; 孙禄; 张学锋; 蒋庄德

doi:10.7652/xjtuxb201308006

您当前的位置：

首页 >

文章列表页 >

多梁结构压阻式测振加速度传感器

更新时间：2025-05-08

- 多梁结构压阻式测振加速度传感器
- Multi-Flexure Piezoresistive Accelerometer for Vibration Detection
- 西安交通大学学报 2013年47卷第8期页码：33-37
- 作者机构：
  
  西安交通大学机械制造系统工程国家重点实验室,西安,710049
- 作者简介：
- 基金信息：
  
  : 2012-11-16。作者简介: 刘岩(1987—),男,博士生;赵玉龙(通信作者),男,教授,博士生导师。基金项目: 国家重点基础研究发展计划资助项目(2009CB724405);教育部长江学者和创新团队发展计划资助项目(IRT1033);国家自然科学基金资助项目(51275402)
- DOI：10.7652/xjtuxb201308006
  中图分类号： TP212
- 网络首发：2013-08-10，
  
  纸质出版：2013
- 稿件说明：
移动端阅览
刘岩, 赵玉龙, 孙禄, 等. 多梁结构压阻式测振加速度传感器[J]. 西安交通大学学报, 2013,47(8):33-37.

Multi-Flexure Piezoresistive Accelerometer for Vibration Detection[J]. 2013, 47(8): 33-37.
刘岩, 赵玉龙, 孙禄, 等. 多梁结构压阻式测振加速度传感器[J]. 西安交通大学学报, 2013,47(8):33-37. DOI： 10.7652/xjtuxb201308006.

Multi-Flexure Piezoresistive Accelerometer for Vibration Detection[J]. 2013, 47(8): 33-37. DOI： 10.7652/xjtuxb201308006.

摘要

为满足制造装备智能化发展对测振传感器的需求

针对常见加速度传感器在性能、成本和微型化上的不足

研制了一种基于微机电系统技术的多梁结构压阻式加速度传感器。通过将2根短小敏感梁引入传统双桥结构的方式

在提升固有频率的同时

保证了传感器仍具有较高的测量灵敏度。利用敏感梁上的最大应力和结构固有频率相乘的结果作为性能评价标准

结合梁变形理论和实际工艺条件确定了传感器的结构尺寸。采用硅材料刻蚀、硼离子注入、溅射金属铝及阳极键合等工艺

制作了传感器芯片。实验结果表明

所研制的加速度传感器能够准确测量不同频率下的加速度信号

在每g下的灵敏度达到了0.544 mV

满量程精度达到了1.76%

固有频率达到了13.61 kHz

相对于双桥结构传感器

其综合性能提升了近85%。

Abstract

To meet the requirements for vibration detection sensor in intelligent manufacturing and overcome shortcomings in the existing accelerometers including unsatisfactory performances

higher cost and bulky volume

a multi-flexure piezoresistive accelerometer is developed based on micro-electro-mechanical system(MEMS)technology. The proposed accelerometer introduces two tiny beams into the conventional quad-beam structure

which enhances the accelerometer's natural frequency without decreasing the sensitivity. The product of natural frequency and sensitivity is regarded as the evaluation factor to determine the sensor structural dimensions

considering the constraints form analytical optimization and manufacturing process. The sensor chip is fabricated by silicon etching

boron implantation

Al sputtering and anodic bonding. The experimental results show that the developed accelerometer possesses a sensitivity of 0.544 mV per gravity acceleration

a full scale accuracy of 1.76% and natural frequency of 13.61 kHz

and can accurately acquire the acceleration signal with different frequencies. Compared with the conventional quad-beam sensor

the comprehensive property of the proposed multi-flexure accelerometer is improved by 85%.

关键词

Keywords

references

中华人民共和国科学技术部. 智能制造科技发展十二五专项规划 [DB/OL]. [2012-10-15]. http:∥www.gov.cn/gzd t/att/att/site1/20120424/001e3741a47411 0045d901.pdf.

VOGL A, WANG D T, STORÅS P, et al. Design process and characterisation of a high-performance vibration sensor for wireless condition monitoring [J]. Sensors and Actuators: A Physical, 2009,153(2):155-161.

ALBARBAR A, MEKID S, STARR A, et al. Suitability of MEMS accelerometers for condition monitoring:an experimental study [J]. Sensors, 2008,8(2):784-799.

LIU Jun, SHI Yunbo, LI Ping, et al. Experimental study on the package of high-g accelerometer [J]. Sensors and Actuators: A Physical, 2012,173(1):1-8.

SANKAR A R, JENCY J G, DAS S. Design, fabrication and testing of a high performance silicon piezoresistive Z-axis accelerometer with proof mass-edge-aligned-flexures [J]. Microsystem Technologies, 2012,18(1):9-23.

赵立波,赵玉龙,蒋庄德. 特种压阻式加速度传感器的研制 [J]. 西安交通大学学报, 2006,40(9):1049-1052.

ZHAO Libo, ZHAO Yulong, JIANG Zhuangde. Research on special piezoresistive acceleration sensor [J]. Journal of Xi'an Jiaotong University, 2006,40(9):1049-1052.

YAZDI N, AYAZI F, NAJAFI K. Micromachined inertial sensors [J]. Proceedings of the IEEE, 1998,86(8):1640-1659.

吴迪,谢贵久,金忠,等. SOI压力传感器的灵敏度优化设计 [J]. 传感技术学报, 2012,25(8):1064-1068.

WU Di, XIE Guijiu, JIN Zhong, et al. Design optimization for the sensitivity of SOI pressure sensor [J]. Chinese Journal of Sensors and Actuators, 2012,25(8):1064-1068.

吴成军. 工程振动与控制 [M]. 西安:西安交通大学出版社, 2008:47-83.

BAO Minhang. Micro mechanical transducers: pressure sensors,accelerometers and gyroscopes [M]. Amsterdam,Netherlands: Elsevier, 2000:295-306.

赵立波,赵玉龙,方续东,等. 耐高温硅隔离压阻力敏芯片的研究 [J]. 西安交通大学学报, 2010,44(9):59-63.

ZHAO Libo, ZHAO Yulong, FANG Xudong, et al. High temperature silicon-on-insulator piezoresistive pressure sensitive chip [J]. Journal of Xi'an Jiaotong University, 2010,44(9):59-63.

ZHAO Yulong, SUN Lu, LIU Yan, et al. Incorporation of the stress concentration slots into the flexures for a high-performance microaccelerometer [J]. Review of Scientific Instruments, 2012,83(7):0750021-0750027.

秦会峰,孟庆森,宋永刚,等. 硼硅玻璃与硅阳极键合界面形成机理分析 [J]. 功能材料, 2006,37(9):1369-1371.

QIN Huifeng, MENG Qingsen, SONG Yonggang, et al. The mechanisms of anodic bonding between borosilicate glass and silicon [J]. Journal of Functional Materials, 2006,37(9):1369-1371.

李科杰. 新编传感器技术手册 [M]. 北京:国防工业出版社, 2002:59-77.

LI Yuefa, ZHENG Qinglong, HU Yating, et al. Micromachined piezoresistive accelerometers based on an asymmetrically gapped cantilever [J]. Journal of Microelectromechanical Systems, 2011,20(1):83-94.

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

考虑齿圈柔性的行星传动系统固有特性与灵敏度研究

大型可展开网状天线展开过程仿真建模与竖向索预拉力优化调控

基于三维特征的微机电系统器件结构设计方法

相对永久密封真空康普顿探测器伽马灵敏度研究

采用多目标粒子群算法的模拟电路故障诊断研究