轴流风扇冲击射流下泡沫铝热沉的换热特性

邝九杰 1; 隋丹 1; 2; 金东范 1; 卢天健 1; 徐明龙 1

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轴流风扇冲击射流下泡沫铝热沉的换热特性

更新时间：2025-05-01

- 轴流风扇冲击射流下泡沫铝热沉的换热特性
- Open-Celled Aluminum Foam Heat Sinks for Electronics Cooling with Axial Fan Impinging Flow
- 西安交通大学学报 2010年44卷第3期页码：6-10
- 作者机构：
  
  1. 西安交通大学强度与振动教育部重点实验室,西安,710049
  2. 西安交通大学能源与动力工程学院,西安,710049
- 作者简介：
- 基金信息：
  
  : 2009-09-01. 作者简介: 邝九杰(1986-),女,博士生;卢天健(联系人),男,教授,博士生导师. 基金项目: 国家重点基础研究发展规划资助项目(2006CB601202);高等学校学科创新引智计划资助项目(B06024);国家自然科学基金资助项目(5676075,10632060);国家高技术研究发展计划资助项目(2006AA03Z519)
- DOI：
  中图分类号： TK124
- 网络首发：2010-03-10，
  
  纸质出版：2010
- 稿件说明：
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邝九杰 1, 隋丹 1, 2, 等. 轴流风扇冲击射流下泡沫铝热沉的换热特性[J]. 西安交通大学学报, 2010,44(3):6-10.

Open-Celled Aluminum Foam Heat Sinks for Electronics Cooling with Axial Fan Impinging Flow[J]. 2010, 44(3): 6-10.
邝九杰 1, 隋丹 1, 2, 等. 轴流风扇冲击射流下泡沫铝热沉的换热特性[J]. 西安交通大学学报, 2010,44(3):6-10. DOI：

Open-Celled Aluminum Foam Heat Sinks for Electronics Cooling with Axial Fan Impinging Flow[J]. 2010, 44(3): 6-10. DOI：

摘要

针对电子元器件的冷却问题

实验研究了孔隙率为0.92、孔密度不同的3种通孔泡沫铝热沉在轴流风扇冲击射流下的换热特性.测量了表征热沉整体换热性能的热阻、表面温差等参数

并与传统翅片式热沉的相应结果进行了比较分析.结果表明:泡沫铝热沉能使加热模块表面温度的分布明显变得均匀

更有利于延长电子元器件的使用寿命

而且泡沫铝热沉可在保持整体换热性能与翅片式热沉相当的条件下

使散热装置的体积和质量均减少约50%.此外

结果也显示出泡沫铝热沉在电子元器件冷却应用上有进一步优化的潜质.

Abstract

The heat transfer performance of open-celled aluminum foam heat sinks under axial fan impinging cooling flow is experimentally studied. Three open-celled aluminum foam samples with different pore sizes and identical porosity(ε=0.92)were tested. The overall thermal resistance and temperature difference on the base plate of the heat sink were measured and compared with those of the conventional plain-fin heat sink. The results obtained show that

with only 50% of the total volume and weight of the conventional fin heat sink

the aluminum foam heat sink can achieve a similar cooling performance and more uniform temperature distribution on the heated base plate. The aluminum foam heat sink has further potential for optimization in terms of foam thickness

pore density and porosity

leading to a further enhancement of its overall heat dissipation performance under axial fan impinging cooling for power electronics.

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references

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MAHDI H, LOPEZ J P, FLUENTES A, et al. Thermal performance of aluminum-foam CPU heat exchangers[J]. Int J Energy RES, 2006, 30: 851-860.

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