西安交通大学金属材料强度国家重点实验室,西安,710049
网络首发:2009-11-10,
纸质出版:2009
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张贵锋 1, 张建勋 1, 李思玉 1, 等. 铝基复合材料的活性液相扩散焊新工艺[J]. 西安交通大学学报, 2009,43(11):71-74.
Novel Process of Active-Transient Liquid Phase(A-TLP)Bonding for Aluminum Matrix Composite[J]. 2009, 43(11): 71-74.
为优化中间层合金系的设计
对液相扩散焊过程中陶瓷颗粒/金属(P/M)界面的弱化、强化及断裂模式进行了研究
发现在采用纯Cu箔的Al
2
O
3
p/Al复合材料液相扩散焊件的剪切断口上
Al
2
O
3
颗粒未破裂
断口上所有Al
2
O
3
颗粒及部分金属表面光滑
无粘结物生成
表明P/M界面结合弱而呈“界面脱粘”断裂方式.为此
提出了一种旨在改善P/M弱界面润湿性的新工艺——活性液相扩散焊
要求所用中间层内必须同时含有降熔元素及可与陶瓷增强相反应的活性元素(Ti).当Ti含量较低时
Al
2
O
3
颗粒增强相表面上出现细微、凹凸不平且不连续的界面粘结物(反应物); 当Ti含量较高时
P/M界面可形成强力结合
剪切测试中足以使一些陶瓷颗粒本身破裂.
The weakening
enhancement and fracture mode of the interface between ceramic particulate reinforcement and metal(P/M)in transient liquid phase(TLP)bonded joint of aluminum matrix composite are investigated to optimize the design of alloying system of interlayer. From the fracture surface of the TLP bonded joint of Al
2
O
3
p/Al using pure copper foil
it can be seen that the Al
2
O
3
particulates exhibit smooth surface without adhesives or disruption
and some areas of metal on fracture surface also appear smooth. The results indicate that the P/M interface bonding gets weak showing interfacial debonding fracture mode. A novel process of active-transient liquid phase(A-TLP)bonding with an interlayer containing both melting point depressant(
MPD)and active alloying element is hence proposed to improve the interfacial wettability between weak P/M interface. When the Ti content is lower
a large amount of discontinuous adhesives with small size are present on the Al
2
O
3
particulate surfaces in the A-TLP bonded joint as a result of reaction
while the P/M interfacial bonding becomes so strong that many Al
2
O
3
particulates are disrupted during shear test in the case of higher Ti content.
YAN J C, XU H B, SHI L, et al. Vibration assisted brazing of SiCp/A356 composites: microstructure and mechanical behaviour [J]. Science and Technology of Welding and Joining, 2008, 13(8): 760-764.
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XU Zhiwu, YAN Jiuchun, WU Gaohui, et al. Interface structure and strength of ultrasonic vibration liquid phase bonded joints of Al2O3p/6061Al composite [J]. Scripta Materialia, 2005, 53(7): 835-839.
ZHANG Guifeng, ZHANG Jianxun, PEI Yi, et al. Joining of Al2O3p/Al composite by transient liquid phase(TLP)bonding and a novel process of active-transient liquid phase(A-TLP)bonding [J]. Materials Science and Engineering: A, 2008, 488(1/2): 146-156.
HUANG J H, WAN Y, ZHAO H T, et al. Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al-Ag-Cu system powders [J]. Materials Science and Technology, 2007, 23(1): 87-91.
HUANG J H, DONG Y L, WAN Y, et al. Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed powders [J]. Materials Science and Technology, 2005, 21(10): 1217-1221.
YAN Jiuchun, XU Zhiwu, WU Gaohui, et al. Interface structure and mechanical performance of TLP bonded joints of Al2O3/6061Al composites using Cu/Ni composite interlayer [J]. Scripta Materialia, 2004, 51(2): 147-150.
GUO Wei, HUA Meng, LAW H W, et al. Liquid-phase impact diffusion welding of SiCp/6061Al and its mechanism [J]. Materials Science and Engineering: A, 2008, 490(1/2): 427-437.
张贵锋,张建勋,裴怡,等. 金属基复合材料过渡液相(TLP)扩散焊中间层设计的改进[J]. 热加工工艺(焊接版), 2006, 35(19): 28-31.
ZHANG Guifeng, ZHANG Jianxun, PEI Yi. Improvement of interlayer design for transient liquid phase bonding of metal matrix composite [J]. Hot Working Technology, 2006, 35(19): 28-31.
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