西安交通大学电力设备电气绝缘国家重点实验室,西安,710049
网络首发:2009-10-10,
纸质出版:2009
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牛博, 宋政湘, 王建华, 等. 继电保护装置信号端口电磁干扰传播通道的建模与仿真[J]. 西安交通大学学报, 2009,43(10):104-108.
Simulation for Electromagnetic Interference Coupling Path of Signal Port of Relay Protection Equipment[J]. 2009, 43(10): 104-108.
为了实现对继电保护装置电磁敏感性的系统化分析及预测
提出了一种描述其信号端口电磁干扰传播通道特性的方法.该方法参照IEC相关电磁兼容试验标准
根据输入、输出波形得到信号端口电磁干扰传播通道传递函数的频域表达式
基于频域采样的离散值
以矢量匹配法(VFM)结合有理函数逼近构造传递函数的宏模型
在宏模型的基础上导出了该电磁干扰传播通道的等效电路.运用这种方法能很好地解决仿真过程中出现的时域、频域混合问题以及随着函数逼近过程中阶数增高出现的矩阵病态问题.通过仿真结果和试验结果的对比
验证了该方法的正确性和可行性.
To realize systematic analysis and forecast for electromagnetic susceptibility(EMS)
a method is presented to characterize electromagnetic interference(EMI)coupling path of signal port of relay protection equipment in power system. Referring to test standard of IEC
the transfer function of EMI coupling path in frequency domain is gotten according to the tested interference waveform. Based on discrete value by sampling in frequency domain
the vector fitting method(VFM)is adopted combining rational function approximation to construct the macromodel and equivalent circuit of EMI coupling path
thus the problem of ill-condition matrix with high order approximation is alleviated and the mixed frequency/time domain problem is solved. Good coincidence between the simulated result and the measurements demonstrates the validity of this modeling method.
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张爱民,张杭,陈德桂,等. 具有屏蔽机壳的电子设备系统级电磁敏感性分析方法[J].西安交通大学学报,2007, 41(2):190-194.
ZHANG Aimin, ZHANG Hang, CHEN Degui, et al. Analytical method of electromagnetic susceptibility for electronic devices with shielded enclosure at system level[J]. Journal of Xi'an Jiaotong University,2007, 41(2):190-194.
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LI Erping, LIU Enxiao.A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects [J]. IEEE Trans on Advanced Packaging, 2004,27(2):213-223.
LIU Enxiao, LI Erping, LI Lewei, et al. Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects [J]. IEEE Trans on Magnetics, 2005, 41(1):65-71.
IEC. IEC 61000-4-4 Electromagnetic compatibility:part 4,section 4 [S]. Zurich, Switzerland:IEC, 2004.
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