方柱微结构芯片射流冲击流动沸腾换热实验研究

郭栋; 魏进家; 张永海

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方柱微结构芯片射流冲击流动沸腾换热实验研究

更新时间：2025-07-09

- 方柱微结构芯片射流冲击流动沸腾换热实验研究
- Experiment of Flow Boiling Heat Transfer on Micro-Pin-Finned Chips with Jet Impingement
- 西安交通大学学报 2011年45卷第1期页码：31-37
- 作者机构：
  
  西安交通大学动力工程多相流国家重点实验室,西安,710049
- 作者简介：
- 基金信息：
  
  : 2010-06-21. 作者简介: 郭栋(1985-),男,硕士生;魏进家(联系人),男,教授,博士生导师. 基金项目: 国家自然科学基金资助项目(50806057);中央高校基本科研业务费专项资金资助项目;教育部新世纪优秀人才计划资助项目(NCET-07-0680)
- DOI：
  中图分类号： TK124
- 网络首发：2011-01-10，
  
  纸质出版：2011
- 稿件说明：
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郭栋, 魏进家, 张永海. 方柱微结构芯片射流冲击流动沸腾换热实验研究[J]. 西安交通大学学报, 2011,45(1):31-37.

Experiment of Flow Boiling Heat Transfer on Micro-Pin-Finned Chips with Jet Impingement[J]. 2011, 45(1): 31-37.
郭栋, 魏进家, 张永海. 方柱微结构芯片射流冲击流动沸腾换热实验研究[J]. 西安交通大学学报, 2011,45(1):31-37. DOI：

Experiment of Flow Boiling Heat Transfer on Micro-Pin-Finned Chips with Jet Impingement[J]. 2011, 45(1): 31-37. DOI：

摘要

对喷射条件下的电子芯片在FC-72中的流动沸腾换热进行了研究

并和同工况下的光滑芯片作了对比.实验选取的工况如下:过冷度为25、35 ℃; 横流速度V

为0.5、1、1.5 m/s; 喷射速度V

为0、1、2 m/s.实验采用的硅片尺寸为10 mm×10 mm×0.5 mm

通过干腐蚀技术在其表面加工出30 μm×120 μm、50 μm×120 μm的方柱微结构.实验表明

所有芯片的换热性能都随过冷度和流速的增加而提高

方柱微结构能明显地强化芯片换热

而射流冲击进一步提高了芯片在高热流密度下的换热性能.同一横流速度下

喷射速度越大

换热性能越好

尤其是V

=0.5 m/s、V

=2 m/s时

强化效果最显著.随着横流速度的增加

射流冲击的强化效果减弱

临界热流密度值增幅减小.

Abstract

The experiment of flow boiling heat transfer on micro-pin-finned chips in FC-72 with jet impingement was conducted.The experimental conditions consisted of two different liquid subcooling degrees(25

35 ℃)

three different cross flow velocities(V

=0.5

1.5 m/s)and three different jet velocities(V

2 m/s).The dimensions of the silicon chips were 10 mm×10 mm×0.5 mm(length×width×thickness)on which two kinds of micro-pin-fins with the dimensions of 30 μm×120 μm

50 μm×120 μm(thickness×height)were fabricated by the dry etching technique.A smooth surface was also tested for comparison.The correlations for nucleate boiling curves and the maximum allowable heat flux curves were obtained.The results show that the heat transfer performance was improved with increasing liquid su

bcooling and flow velocity.All micro-pin-finned surfaces displayed a considerable heat transfer enhancement.The addition of jet impingement further enhanced the heat transfer at a high heat flux and increased the CHF.At a certain cross flow velocity

the enhancement was more significant as the jet velocity increased

especially for V

=0.5 m/s

=2 m/s.For the micro-pin-finned chips

the CHF increased by more than 93% while the subcooling was 35 ℃ compared with V

=0.5 m/s

=0 m/s.As the cross velocity increased

the intensification degree of jet impingement decreased and the increase of CHF also decreased.

关键词

Keywords

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