一种利用气泡泵效应重力辅助回路热管的实验研究

韩晓红; 闵旭伟; 李鹏; 张玉佳; 陈光明; 王勤

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一种利用气泡泵效应重力辅助回路热管的实验研究

更新时间：2025-07-09

- 一种利用气泡泵效应重力辅助回路热管的实验研究
- Experimental Study on an Thermosyphon Loop with Bubble Pump Effect
- 西安交通大学学报 2012年46卷第3期页码：9-14
- 作者机构：
  
  浙江大学制冷与低温研究所,杭州,310027
- 作者简介：
- 基金信息：
  
  : 2011-07-22. 作者简介: 韩晓红(1973-),女,副教授. 基金项目: 国家自然科学基金资助项目(50806063);浙江省重点科技创新团队项目(2009R50036)
- DOI：
  中图分类号： TB65
- 网络首发：2012-03-10，
  
  纸质出版：2012
- 稿件说明：
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韩晓红, 闵旭伟, 李鹏, 等. 一种利用气泡泵效应重力辅助回路热管的实验研究[J]. 西安交通大学学报, 2012,46(3):9-14.

Experimental Study on an Thermosyphon Loop with Bubble Pump Effect[J]. 2012, 46(3): 9-14.
韩晓红, 闵旭伟, 李鹏, 等. 一种利用气泡泵效应重力辅助回路热管的实验研究[J]. 西安交通大学学报, 2012,46(3):9-14. DOI：

Experimental Study on an Thermosyphon Loop with Bubble Pump Effect[J]. 2012, 46(3): 9-14. DOI：

摘要

随着芯片集成度的提高及微型化

为了满足高热流密度电子器件的散热需求

提出了一种利用气泡泵效应重力辅助回路热管

并对其传热性能进行了详细的实验研究.实验中加热功率为21～646 W

对应热流密度范围为1.67～51.4 W/cm

采用去离子水为工质.研究结果表明:利用气泡泵效应虽然会增大传输过程的传输热阻

但却能有效增强蒸发腔内扰流

进而增强换热

提高临界换热热流密度; 加热功率为646 W时

最小热阻为0.11 ℃/W; 对于本装置

存在一个最佳充液高度

通过观察实验流型图可知

当上升管内为环状流时

充液高度比较合理; 蒸发段热阻始终占据总热阻主要部分.研究工作为其在芯片冷却领域的应用打下了良好基础.

Abstract

An advanced thermosyphon loop using bubble pump effect was proposed in order to meet the need of the chip heat dissipation at high heat flux. The experiment was conducted to investigate the heat transfer performance of the loop with deionized water as the working fluid at the heat load of 21-646 W and the corresponding heat flux of 1.67-51.4 W/cm

. The experimental results show that although the bubble pump effect will increase the heat transmission resistance and but it can effectively enhance the deionized water turbulence in evaporator cavities

leading to the increases in heat transfer capacity and the critical heat transfer heat flux. Moreover

the minimum thermal resistance was 0.11 ℃/W when the heat load was 646 W

and there was an optimum charging liquid level for the loop. In addition

the charging height was reasonable when the flow pattern was annular flow in

the ascending tube

and the evaporation thermal resistance was major part of the overall thermal resistance. These results may be beneficial to further research on chip cooling.

关键词

Keywords

references

MOORE G E. Cramming more components onto integrated circuits[J].Electronics, 1965, 38(8):114-117.

宗朝晖. 现代电力电子的冷却技术[J].变流技术与电力牵引,2007,4:6-12.

ZONG Chaohui. Cooling technology of modern power electronics[J]. Converter Technology Electric Traction,2007,4:6-12.

曾平,程光明,刘九龙,等. 压电泵为动力源的计算机芯片水冷系统研究[J]. 压电与声光,2006,28(4):403-406.

ZENG Ping, CHENG Guangming, LIU Jiulong,et al. Practical research on water cooling system with computer chip driven by PZT pump[J]. Piezoelectectrics Acoustooptics, 2006,28(4):403-406.

曾平,程光明,刘九龙,等. 集成式计算机芯片水冷系统的研究[J]. 西安交通大学学报, 2005, 39(11):1207-1210.

ZENG Ping, CHENG Guangming, LIU Jiulong, et al. Compositive water-cooling system applied to computer chip[J]. Journal of Xi'an Jiaotong University,2005,39(11):1207-1210.

MA K Q,LIU J. Heat driven liquid metal cooling device for the thermal management of computer chip [J]. Journal of Physics: D Applied Physics, 2007,40(15):4722-4729.

盖东兴,刘志春,刘伟,等. 重力辅助平板型环路热管实验研究[J]. 热能动力工程,2010,25(2):196-201.

GAI Dongxing, LIU Zhichun, LIU Wei, et al. Experimental study of a gravity-assisted plate type of loop heat pipe[J]. Journal of Engineering for Thermal Energy and Power,2010,25(2):196-201.

YEH C C, CHEN C N, CHEN Y M. Heat transfer analysis of a loop heat pipe with biporous wicks[J]. International Journal of Heat and Mass Transfer, 2009,52:4426-4434.

CHANG Yuwei, CHENG Chiaohung, WANG Jungchang, et al. Heat pipe for cooling of electronic equipment[J]. Energy Conversion and Management,2008, 49:3398-3404.

VASILIEV L, LOSSOUARN D, ROMESTANT C,et al. Loop heat pipe for cooling of high-power electronic components[J]. International Journal of Heat and Mass Transfer, 2009, 52:301-308.

KHANDEKAR S, SCHNEIDER M, SCHAFER P, et al. Thermofluid dynamic study of flat plate closed-loop pulsating heat pipes[J].Micro-Scale Thermalphysical, 2002, 6(4):303-317.

MAYDANIK Y F, DMITRIN V I, PASTUKHOV V G. Compact cooler for electronics on the basis of a pulsating heat pipe[J]. Applied Thermal Engineering, 2009, 29:3511-3517.

MIYAZAKI Y. Cooling of notebook PCs by flexible oscillating heat pipes [C]∥Proceedings of IPACK2005. San Francisco, USA: ASME, 2005:1-5.

孙志坚. 电子器件回路型热管散热器的数值模拟与试验研究[D].杭州:浙江大学,2007.

PAL A, JOSHI Y K, BEITELMAL M H, et al. Design and performance evaluation of a compact thermosyphon[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(4):601-606.

KHODABANDEH R. Thermal performance of a closed advanced two-phase thermosyphon loop for cooling of radio base stations at different operating conditions[J]. Applied Thermal Engineering, 2004, 24:2643-2655.

KHODABANDEH R. Heat transfer in the evaporator of an advanced two-phase thermosyphon loop[J]. International Journal of Refrigeration, 2005, 28:190-202.

徐永田. 先进热虹吸管中具有新颖强化传热表面蒸发器的实验研究[D].济南:山东大学,2008.

何曙, 夏再忠, 王如竹. 一种新型重力热管传热性能研究[J]. 工程热物理学报,2009,30(5):834-836.

HE Shu, XIA Zaizhong, WANG Ruzhu. Heat transfer characteristics of an innovative gravity heat pipe[J]. Journal of Engineering Thermophysics, 2009,30(5):834-836.

PHELAN P E, CHIRIAC V A, LEE T Y T. Current and future miniature refrigeration cooling technologies for high power microelectronics[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(3):356-364.

刘益才. 电子芯片冷却技术发展综述[J]. 电子器件,2006,29(1):296-300.

LIU Yicai. Recent development and prospects of the electronic apparatus cooling[J]. Chinese Journal of Electron Devices, 2006,29(1):296-300.

TUCKERMAN D B, PEASE R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters,1981,2(5):126-129.

DANG B, BAKIR M S, MEINDL J D. Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink[J].IEEE Electron Device Letters, 2006,27(2):117-119.

HEFFINGTON S N, GLEZER A. Two-phase thermal management using B small-scale, heat transfer cell based on vibration-induced droplet atomization[C]∥Inter Society Conference on Thermal Phenomena. Piscataway, NJ, USA: IEEE, 2004:90-94.

HEFFINGTON S N, BLACK W Z, GLEZER A.Vibration-induced droplet atomization heat transfer cell for high heat flux applications[C]∥Inter Society Conference on Thermal Phenomena. Piscataway, NJ, USA: IEEE, 2002:408-412.

汤成伟,刘道平,祁影霞,等. 单压吸收式Einstein循环制冷机中气泡泵的性能分析[J].制冷学报,2009,30(3):35-38.

TANG Chengwei, LIU Daoping, QI Yingxia, et al. Performance of bubble pump in single-pressure Einstein absorption refrigerator[J]. Journal of Refrigeration, 2009,30(3):35-38.

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