针对芯片散热表面热流具有典型的中心高四周低的非均匀分布特征
设计制备了具有三阶Sierpinski地毯曲线分形特点的亲疏水交错润湿铜表面
并通过实验观测了气泡在典型的亲/疏水分形表面的动力学特性。结果表明
气泡会首先在预设的高阶疏水点处成核、生长
并呈现典型的分形特征
实现了初始气泡成核位置的可控分布;之后
相互邻近的疏水点上的气泡开始克服能垒而发生合并
同时伴随着高阶疏水区域的气泡向中央低阶区域的定向移动、合并过程
最终在中心一阶疏水区域形成大气泡。相比于光滑及疏水点阵表面
Sierpinski亲/疏水交错润湿表面不仅能够有效降低液体起始沸腾温度
提高沸腾换热的临界热流密度
而且可以规划气泡的成核点及移动、合并方向
进而实现气泡空间分布与加热壁面热流密度分布的协同一致。因此
具有Sierpinski分形特性的亲/疏水交错润湿表面进一步提高了沸腾换热性能。
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