LI Yanan, WANG Chunling, SHI Yawen, et al. Experimental Study on Heat Transfer Characteristics of Vapor Chambers with Inverse Opal Wick Structures[J]. Journal of Xi'an Jiaotong University, 2026, 60(4): 210-217.
DOI:
LI Yanan, WANG Chunling, SHI Yawen, et al. Experimental Study on Heat Transfer Characteristics of Vapor Chambers with Inverse Opal Wick Structures[J]. Journal of Xi'an Jiaotong University, 2026, 60(4): 210-217.DOI: 10.7652/xjtuxb202604017.
Experimental Study on Heat Transfer Characteristics of Vapor Chambers with Inverse Opal Wick Structures
To address the issue of insufficient liquid supply in the evaporation section under high heat flux in traditional vapor chambers,caused by the difficulty in simultaneously achieving high capillary pressure and high permeability due to the single pore size and irregular channels of conventional wicks,an ordered micro/nano face-centered cubic porous structure is introduced into the field of heat pipe cooling.A vapor chamber utilizing a superhydrophilic copper inverse opal porous structure as the wick was fabricated.Firstly,an ordered face-centered cubic inverse opal structure was prepared via electrochemical deposition using a self-assembled opal template.The coupling of its large interconnected pores and small sintered necks resulted in a porous structure with high capillary pressure and high permeability.Subsequently,superhydrophobic micro/nano structured copper was employed as the condenser surface to achieve dropwise condensation with high heat transfer coefficients and
j umping-droplet liquid return.Finally,the vapor chamber was assembled by sealing the evaporator and condenser sections,followed by evacuation and liquid filling.Experimental studies on the heat transfer characteristics of the fabricated vapor chamber were conducted using a custom-built testing system.The results indicate that,with deionized water as the working fluid at a 50% filling ratio,the vapor chamber exhibits a heat dissipation capacity greater than 244 W/cm
2
,a minimum total thermal resistance of 0.1450 ℃/W,and a minimum thermal uniformity resistance of 0.0267 ℃/W,demonstrating a higher heat transfer limit compared to conventional vapor chambers.This study reveals the critical role of ordered porous structures in enhancing the heat transfer limit of vapor chambers,providing a promising solution for thermal management of electronic devices with higher heat flux.
HAO Junjiao,PAN Ri,ZHOU Gang,et al.Development of heat pipe cooling technology in high heat flux electronic components [J]. Chemical Industry and Engineering Progress,2015,34(5):1220-1224.
李聪.基于不同热负荷的超薄均热板传热传质特性研究[D].广州:华南理工大学,2018.
CHEN Gong,TANG Yong,DUAN Longhua,et al. Thermal performance enhancement of micro-grooved aluminum flat plate heat pipes applied in solar collectors [J].Renewable Energy,2020,146:2234-2242.
KOUKORAVAS T P,DAMOULAKIS G,MEGARI-DIS C M.Experimental investigation of a vapor chamber featuring wettability-patterned surfaces [J]. Applied Thermal Engineering,2020,178:115522.
HUANG Jiale,ZHOU Wei,XIANG Jianhua,et al. Development of novel flexible heat pipe with multistage design inspired by structure of human spine [J]. Applied Thermal Engineering,2020,175:115392.
彭毅.基于植物叶片结构的仿生均热板研究[D].广州:华南理工大学,2015.
EGBO M.A review of the thermal performance of vapor chambers and heat sinks:critical heat flux,thermal resistances,and surface temperatures [J].International Journal of Heat and Mass Transfer,2022,183(Part B):122108.
ZOHURI B.Heat pipe design and technology:modern applications for practical thermal management [M]. 2nd ed.Cham,Switzerland:Springer International Publishing,2016.
XIE Dongdong,SUN Yunna,WANG Guilian,et al. Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it:a critical review [J].International Journal of Heat and Mass Transfer,2021,175:121132.
BULUT M,KANDLIKAR S G,SOZBIR N.A review of vapor chambers [J].Heat Transfer Engineering,2019,40(19):1551-1573.
WAN Yi,YAN Ke,DONG Shun,et al.Review on flat micro-heat pipe technology[J].Electro-Mechanical Engineering,2015,31(5):5-10.
陈恭.气液共面结构超薄均热板设计制造及其性能研究[D].广州:华南理工大学,2021.
CAI Qingj un,CHEN Bingchung,TSAI C.Design,development and tests of high-performance silicon vapor chamber [J].Journal of Micromechanics and Microengineering,2012,22(3):035009.
NAM Y,SHARRATT S,BYON C,et al.Fabrication and characterization of the capillary performance of superhydrophilic Cu micropost arrays [J].Journal of Microelectromechanical Systems,2010,19(3):581-588.
YANG K S,LIN Chenchuan,SHYU J C,et al.Performance and two-phase flow pattern for micro flat heat pipes [J].International Journal of Heat and Mass Transfer,2014,77:1115-1123.
ZENG Jian,LIN Lang,TANG Yong,et al.Fabrication and capillary characterization of micro-grooved wicks with reentrant cavity array [J].International Journal of Heat and Mass Transfer,2017,104:918-929.
ZENG Jian,ZHANG Shiwei,CHEN Gong,et al. Experimental investigation on thermal performance of aluminum vapor chamber using micro-grooved wick with reentrant cavity array [J].Applied Thermal Engineering,2018,130:185-194.
LUO Jiali,MO Dongchuan,WANG Yaqiao,et al. Biomimetic copper forest wick enables high thermal conductivity ultrathin heat pipe [J]. ACS Nano,2021,15(4):6614-6621.
SUN Zhen,CHEN Xiaodan,QIU Huihe.Experimental investigation of a novel asymmetric heat spreader with nanostructure surfaces [J].Experimental Thermal and Fluid Science,2014,52:197-204.
ZHANG Chi,PALKO J W,BARAKO M T,et al. Enhanced capillary-fed boiling in copper inverse opals via template sintering [J].Advanced Functional Materials,2018,28(41):1803689.
FAN Desong,FANG Jun,TONG Wenyi,et al.An inverse opal complex wick for high-performance ultrathin heat pipes [J].Cell Reports Physical Science,2024,5(9):102156.
TSAI M C,KANG S W,VIEIRA DE PAIVA K.Experimental studies of thermal resistance in a vapor chamber heat spreader [J].Applied Thermal Engineering,2013,56(1/2):38-44.
JI Xianbing,LI Hongchuan,XU Jinliang,et al.Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices [J]. Experimental Thermal and Fluid Science,2017,85:119-131.
JI Xianbing,XU Jinliang,ABANDA A M.Copper foam based vapor chamber for high heat flux dissipation [J]. Experimental Thermal and Fluid Science,2012,40:93-102.
LI Ji,LV Lucang.Experimental studies on a novel thin flat heat pipe heat spreader [J].Applied Thermal Engineering,2016,93:139-146.
HSIEH J C,HUANG H J,SHEN S C.Experimental study of microrectangular groove structure covered with multi mesh layers on performance of flat plate heat pipe for LED lighting module [J].Microelectronics Reliability,2012,52(6):1071-1079.