Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces

WANG Chen; LIN Qiyin; QIU Mingjun; HONG Jun

doi:10.7652/xjtuxb202509007

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Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces

更新时间：2025-09-11

- Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces
- Journal of Xi’an Jiaotong University Vol. 59, Issue 9, Pages: 65-76(2025)
- 作者机构：
  
  1.西安交通大学现代设计及转子轴承系统教育部重点实验室， 710049，西安
  2.西安交通大学机械工程学院， 710049，西安
  3.金属成形技术与重型装备全国重点实验室， 710018，西安
  4.中国重型机械研究院股份公司， 710018，西安
- 作者简介：
- 基金信息：
- DOI：10.7652/xjtuxb202509007
  CLC： TH122
- Received：05 March 2025，
  
  Online First：27 April 2025，
  
  Published：10 September 2025
- 稿件说明：
移动端阅览
WANG Chen, LIN Qiyin, QIU Mingjun, et al. Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces[J]. Journal of Xi’an Jiaotong University, 2025, 59(9): 65-76.
DOI：

WANG Chen, LIN Qiyin, QIU Mingjun, et al. Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces[J]. Journal of Xi’an Jiaotong University, 2025, 59(9): 65-76. DOI： 10.7652/xjtuxb202509007.

摘要

为解决装配界面接触热性能不足引起的散热性能和工作性能不足的问题，首先，构建了基于实测粗糙表面形貌的装配界面接触热性能数值分析模型；其次，测试了相应压力和温度工况下接触热阻以验证数值模型的准确性；最后，从装配界面微观接触传热机理出发，提出了装配界面导热特性异质化设计思路，建立了装配界面导热特性渐进迭代优化设计方法。结果表明：构建的装配界面接触热性能数值分析模型能够实现接触热性能的高精度预测，与实验结果对比，相对误差为15.52%；装配界面导热特性异质化设计通过提高界面温度梯度分布均匀性，有效降低接触热阻，优化设计后接触热性能提高23.12%。该研究为保障电子芯片封装、航天飞行器等热敏感复杂机械产品的接触热性能与整体散热性能提供了新的技术支撑。

Abstract

To address the inadequate heat dissipation and operational performance caused by insufficient contact thermal performance at assembly interfaces

this study first establishes a numerical analysis model for contact thermal performance based on measured rough surface topography of assembly interfaces. Subsequently

contact thermal resistance under corresponding pressure and temperature conditions is tested to verify the accuracy of the numerical model. Finally

starting from the microscopic heat transfer mechanism at the assembly interface

a heterogeneous design approach for thermal conductivity is proposed

establishing a progressive iterative optimization design method for the thermal conductivity of assembly interfaces. The results demonstrate that the constructed numerical analysis model for contact thermal performance can achieve high-precision predictions

with a relative error of 15.52%. The heterogeneous design of thermal conductivity effectively reduces contact thermal resistance by improving the uniformity of temperature gradient distribution at the interface

resulting in a 23.12% improvement in contact thermal performance after optimization. This study provides new technical support for ensuring the contact thermal performance and overall heat dissipation in thermally sensitive complex mechanical products

such as electronic chip packaging and aerospace vehicles.

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references

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