Experimental Study on Thermal Contact Resistance of Heat Transfer Interface of ODS MA754 Alloy

YANG Wankui; GUO Xiaoyu; ZENG Herong; GUO Yuchuan; TANG Bin; WANG Guanbo; YAN Ruihao; MENG Zhaoming; GUO Simao

doi:10.7652/xjtuxb202402010

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Experimental Study on Thermal Contact Resistance of Heat Transfer Interface of ODS MA754 Alloy

更新时间：2025-05-13

- Experimental Study on Thermal Contact Resistance of Heat Transfer Interface of ODS MA754 Alloy
- Vol. 58, Issue 2, Pages: 100-108(2024)
- 作者机构：
  
  1. 中国工程物理研究院核物理与化学研究所,四川,绵阳,621900
  2. 黑龙江省核动力装置性能与设备重点实验室,哈尔滨,150001
  3. 哈尔滨工程大学核科学与技术学院,哈尔滨,150001
- 作者简介：
- 基金信息：
- DOI：10.7652/xjtuxb202402010
  CLC： TK121
- Online First：10 February 2024，
  
  Published：2024
- 稿件说明：
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YANG Wankui, GUO Xiaoyu, ZENG Herong, et al. Experimental Study on Thermal Contact Resistance of Heat Transfer Interface of ODS MA754 Alloy[J]. 2024, 58(2): 100-108.
DOI：

YANG Wankui, GUO Xiaoyu, ZENG Herong, et al. Experimental Study on Thermal Contact Resistance of Heat Transfer Interface of ODS MA754 Alloy[J]. 2024, 58(2): 100-108. DOI： 10.7652/xjtuxb202402010.

摘要

鉴于ODS MA754合金传热界面的接触热阻参数对全固态堆芯空间反应堆系统的热量导出具有重要影响

研发和设计了高温高压接触热阻实验装置

测量了不同温度(20～800 ℃)、压力(0～80 MPa)、气体氛围(He、CO

)以及试件表面粗糙度(1.6、3.2 μm)下ODS MA754合金传热界面的接触热阻

并基于测试获得的宽量程数据点

建立了ODS MA754合金的接触热阻数据库。实验结果表明:随着接触面温度和压力的升高

界面接触热阻降低

且热阻降低的速率逐渐减小; 相较于表面粗糙度为1.6 μm的试件

粗糙度为3.2 μm试件表面的界面接触热阻明显偏大

实验得到的定量关系可为工程样件的加工粗糙度要求提供依据; He气氛下的接触热阻远小于CO

气氛

在0.1 MPa、100 ℃工况下

He气氛接触热阻约为CO

气氛接触热阻的1/4。该研究结果可为空间反应堆的热工设计提供数据参考。

Abstract

Considering the thermal contact resistance parameters of ODS MA754 alloy have a significant impact on the heat transfer of all solid-state core space reactor systems

high-temperature and high-pressure thermal contact resistance measuring devices are developed and designed to measure the ODS MA754 alloy heat transfer interface thermal contact resistance under different temperatures(20—800 ℃)

different pressures(0—80 MPa)

different roughness(1.6 and 3.2 μm)and in different gas environments(He and CO

). The thermal contact resistance database of ODS MA754 alloy is established accordingly. The experimental results show that the interface thermal contact resistan

ce decreases with the increase of contact temperature and pressure

and the rate of thermal resistance reduction decreases gradually. The interface contact thermal resistance of the test piece with the roughness of 3.2 μm is apparently greater than that of roughness 1.6 μm. The obtained quantitative relationship can provide reference for the machining roughness requirements of subsequent engineering samples. The thermal contact resistance in Helium environment is far less than that in CO

environment. Under 0.1 MPa and 100 ℃ working conditions

the thermal contact resistance in Helium environment is about one fourth of that in CO

environment. The study results can provide data reference for the thermal design of space reactor.

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Keywords

references

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