The diffusion bonding of TC4 titanium alloy was improved by using hydrogenation technology
and the diffusion bonding process parameters were optimized. Vacuum diffusion bonding experiments of hydrogenated TC4 titanium alloy with different hydrogen content were carried out on the Gleeble1500D thermal simulator using the solid-state hydrogenation technology. Scanning electron microscopy was used to analyze the interface void-filling rate and interface morphology. The results show that the diffusion coefficient of hydrogen can significantly increase the diffusion coefficient of the hydrogenated TC4 titanium alloy
lower the α+β→β transition temperature
stabilize the β phase in the alloy
and promote the diffusion of grain boundaries. The grain boundary activity was enhanced
thereby the material's hot working deformation was improved. When the hydrogen content of the hydrogenated titanium alloy was 0.25%
the diffusion bonding temperature was 840 ℃
the pressure was 15 MPa
and the holding time was 60 min
the interface was well bonded
where there was no diffusion holes in the weld zone
the titanium alloy matrix structure was still equiaxed α+β two-phase structure
and the crystal grains did not grow significantly.
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