Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material

doi:10.7652/xjtuxb201609010

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Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material

更新时间：2025-07-09

- Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material
- Vol. 50, Issue 9, Pages: 61-65+73(2016)
- 作者机构：
  
  大连海事大学轮机工程学院,辽宁,大连,116026
- 作者简介：
- 基金信息：
- DOI：10.7652/xjtuxb201609010
  CLC： TK121
- Online First：10 September 2016，
  
  Published：2016
- 稿件说明：
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Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material[J]. 2016, 50(9): 61-65+73.
DOI：

Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material[J]. 2016, 50(9): 61-65+73. DOI： 10.7652/xjtuxb201609010.

摘要

为强化界面传热

研制了一种以铜颗粒为填充材料、Ga

62.5

21.5

液态金属为基体的新型复合热界面材料

并对其导热性能进行了测试。首先将所制备的热界面材料放置在两片铜片之间

制备3层结构试样

然后利用激光导热仪测量所制备试样的导热性能

并计算相应试样的接触热阻。实验结果表明:铜颗粒填充型液态金属可以大大提高氧化后液态金属作为热界面材料的性能

利用铜粉质量分数分别为5%和10%的液态金属所制备的试样

导热系数和接触热阻分别为(200.33±15.66)、(233.08±18.07)W/(m·K)和(7.955±0.627)、(5.621±0.437)mm

·K/W

较利用氧化后液态金属所制备试样的导热系数分别约提高了68%和96%

接触热阻分别约降低了57%和70%

并可以有效降低液态金属的流动性

从而减少液态金属在使用过程中溢出现象的发生。

Abstract

In order to enhance the interface heat transfer

62.5

21.5

liquid metal alloy(LMA)with addition of copper particles as the thermal interface material(TIM)was investigated. Samples with sandwiched structures were fabricated by inserting the LMA TIMs between two copper plates. The laser flash analysis method was applied to measure the overall thermal conductivity of these samples. The results indicated that the addition of copper particles can obviously improve the thermal performance of oxidized LMA used as TIM. The measured thermal conductivity and thermal contact resistance of oxidized LMA samples fi

lled with copper particles(the mass fractions of the copper particles are 5% and 10%

respectively)were(200.33±15.66)

(233.08±18.07)W/(m·K)and(7.955±0.627)

(5.621±0.437)mm

·K/W

respectively. Compared with the samples of oxidized LMA without copper particles

the thermal conductivity was increased by about 68% and 96%

and the thermal contact resistance was decreased by about 57% and 70%

respectively. In addition

the fluidity of LMA can also be reduced with the addition of copper particles

hence alleviating the pump out effect in its practical use.

关键词

Keywords

references

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