A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array

doi:10.7652/xjtuxb201304002

您当前的位置：

首页 >

文章列表页 >

A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array

更新时间：2025-07-09

- A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array
- Vol. 47, Issue 4, Pages: 6-10(2013)
- 作者机构：
  
  西安交通大学机械工程学院,西安,710049
- 作者简介：
- 基金信息：
- DOI：10.7652/xjtuxb201304002
  CLC： TN305.7
- Online First：10 April 2013，
  
  Published：2013
- 稿件说明：
移动端阅览
A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array[J]. 2013, 47(4): 6-10.
DOI：

A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array[J]. 2013, 47(4): 6-10. DOI： 10.7652/xjtuxb201304002.

摘要

为了批量制造微透镜阵列

研究了热压印制造无缝隙六边形微透镜阵列工艺中的压印力和脱模温度。采用有限元方法

计算了无缝隙六边形微透镜阵列聚甲基丙烯酸甲酯(PMMA)压印过程中的应力变化

分析了模具与PMMA之间的黏附力影响因素。研究结果表明:随着脱模温度的降低

PMMA法向应力逐渐降低

并存在最低应力; PMMA与模具间黏附力随PMMA内的法向应力降低而减弱; 当脱模温度降低到20 ℃时

微透镜阵列高度保真度达到了94.7%

大规模消除了压印缺陷。

Abstract

The embossing stress and demolding temperature in the manufacturing process of the gapless hexagonal microlens array by hot embossing process are studied for large-scale manufacturing. The stress change of polymethylmethacrylate(PMMA)in the gapless hexagonal microlens array embossing process is simulated by finite element method. Influencing factors of adhesion strength between mold and PMMA are analyzed. The analysis results show that the normal stress decreases and reaches the lowest level at last when the demolding temperature reduces. The adhesion strength declines as the demolding temperature decreases. When the demolding temperature drops to 20 ℃

the height fidelity of embossing specimen reaches 94.7%

and embossing defects are eliminated in a large scale.

关键词

Keywords

references

STEVENS R, MIYASHITA T. Review of standards for microlenses and microlens arrays [J]. Imaging Science Journal, 2010, 58(4): 202-212.

LIU Hewei, CHEN Feng, YANG Qing, et al. Fabrication of bioinspired omnidirectional and gapless microlens array for wide field-of-view detections [J]. Applied Physics Letters, 2012, 100(13): 133701-133703.

GORDON N T, JONES C L, PURDY D J. Application of microlenses to infrared detector arrays [J]. Infrared Physics, 1991, 31(6): 599-604.

WEI M K, SU I L. Method to evaluate the enhancement of luminance efficiency in planar OLED light emitting devices for microlens array [J]. Optics Express, 2004, 12(23): 5777-5782.

PAN C T, SU C H. Fabrication of gapless triangular micro-lens array [J]. Sensors and Actuators: A Physical, 2007, 134(2): 631-640.

KUANG Dengfeng, ZHANG Xiaoliang, GUI Min, et al. Hexagonal microlens array fabricated by direct laser writing and inductively coupled plasma etching on organic light emitting devices to enhance the outcoupling efficiency [J]. Applied Optics, 2009, 48(5): 974-978.

GUO Yuhua, LIU Gang, ZHU Xuelin, et al. Analysis of the demolding forces during hot embossing [J]. Microsystem Technologies, 2007, 5(13): 411-415.

CHEN Feng, LIU Hewei, YANG Qing, et al. Maskless fabrication of concave microlens arrays on silica glasses by a femtosecond-laser-enhanced local wet etching method [J]. Optics Express, 2010, 18(19): 20334-20343.

CHOU S Y, KRAUSS P R, RENSTROM P J. Imprint of sub-25 nm vias and trenches in polymers [J]. Applied Physics Letters, 1995, 67(21): 3114-3116.

WORGULL M, HECKELE M, HETU J F, et al. Modeling and optimization of the hot embossing process for micro-and nanocomponent fabrication [J]. Journal of Microlithography, Microfabrication, and Microsystems, 2006, 5(1): 1005-1013.

LAN S, LEE H J, LEE S H, et al. Experimental and numerical study on the viscoelastic property of polycarbonate near glass transition temperature for micro thermal imprint process [J]. Materials Design, 2009, 30(9): 3879-3884.

MIRKHALAF M, TOR S B, MURUKESHAN V M, et al. Optimization of compression molding of stand-alone microlenses: Simulation and experimental results [J]. Polymer Engineering Science, 2010, 50(11): 2216-2228.

KIM N W, KIM K W, SIN H C. Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model [J]. Microelectron Eng, 2008, 85(9): 1858-1865.

DIRCKX M E, HARDT D E. Analysis and characterization of demolding of hot embossed polymer microstructures [J]. Journal of Micromechanics and Microengineering, 2011, 21(8): 085024.

马皓晨. 微机电系统中粘附的表面效应和尺寸效应的研究 [D]. 镇江: 江苏大学, 2005.

JUNG Gunyoung, LI Zhiyong, WU Wei, et al. Vapor-phase self-assembled monolayer for improved mold release in nanoimprint lithography [J]. Langmuir, 2005, 21(4): 1158-1161.

BECK M, GRACZYK M, MAXIMOV I, et al. Improving stamps for 10 nm level wafer scale nanoimprint lithography [J]. Microelectronic Engineering, 2002, 61/62: 441-448.

LIU Hewei, CHEN Feng, YANG Qing, et al. Facile and flexible fabrication of gapless microlens arrays using a femtosecond laser microfabrication and replication process [C]∥Proceedings of SPIE8243, Laser Applications in Microelectronic and Optoelectronic Manufacturing. Bellingham, WA, USA: SPIE, 2012: 2430-2436.

SHUAI Cijun, DUAN Jian, ZHONG Jue. Novel manufacturing method of optical fiber coupler [J]. Journal of Central South University of Technology: English Edition, 2006, 13(3): 242-246.

Views

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Design and Experimental Verification for Diaphragm Compressor Cavity Profile by Two Exponential Terms Generatrix

Thermal-Mechanical Coupled Analysis for Right Angle Bend of Directly Buried Heating Pipeline

Strength Analysis and Design Improvement of the Tie Rods in Circumferentially Distributed Rod Fastening Rotors

Mechanism and Optimal Control Strategy for Hysteresis in Rapid Dehumidification Response of Indirect Thermal Systems in Electric Vehicles

Numerical Simulation of the Energy Conversion Process in Thermoacoustic Engines with Different Stack Materials

Related Author

李霁阳 1

赵晓华 2

贾晓晗 1

彭学院 1

江超 1

官燕玲 1

邓顺熙 1

孟庆龙 1

Related Institution

School of Energy and Power Engineering, Xi'an Jiaotong University

School of Environmental Science and Engineering, Chang'an University

⁰