A novel planar electromagnetic band-gap(EBG)structure is proposed to suppress the simultaneous switching noise(SSN)within the power/ground planes of the printed circuit boards. The novel design bases on the facts that meander lines increase the effective inductance of EBG patches
and that the unit cell of the EBG power plane consists of one square patch with the slots and four meander line bridges. The proposed design is validated by HFSS numerically
and comparisons with the L-bridged EBG of the same parameters
under the conditions with the -30 dB suppression and bandwidth ranging from 0.45 GHz to 5.3 GHz show that the lower cut-off frequency is decreased by 150 MHz
and the relative bandwidth is increased by about 15%. The proposed EBG power plane is fabricated and measured
and good agreement between the simulated and measured results is found along with the omni-directional suppression of the SSN. It is also found that good signal integrity performance can be obtained when differential transmission lines are used.
关键词
Keywords
references
SWAMINATHAN M, KIM J, NOVAK I, et al. Power distribution networks for system-on-package: status and challenges [J]. IEEE Transactions on Advanced Packaging, 2004, 27(2): 286-300.
VAN DER BERGHE S, OLYSLAGER F, DE ZUTTER D, et al. Study of the ground bounce caused by power plane resonances [J]. IEEE Transactions on Electromagnetic Compatibility, 1998, 40(2): 111-119.
ABHARI R, ELEFTHERIADES G V. Metallo-dielectric electromagnetic band-gap structures for suppression and isolation of the parallel-plate noise in high-speed circuits [J]. IEEE Transactions on Microwave Theory and Techniques, 2003, 51(6):1629-1639.
SIEVENPIPER D, ZHANG Lijun, JIMENEZ B R F. High-impedance electromagnetic surfaces with a forbidden frequency band [J]. IEEE Transactions on Microwave Theory and Techniques, 1999, 47(11):2059-2074.
SHAHPARNIA S, RAMAHI O M. Electromagnetic interference(EMI)reduction from printed circuit boards(PCB)using electromagnetic bandgap structures [J]. IEEE Transactions on Electromagnetic Compatibility, 2004, 46(4):580-587.
KAMGAING T, RAMAHI O M. A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface [J]. IEEE Microwave and Wireless Components Letters, 2003, 13(1):21-23.
WU Tzong-Lin, LIN Yen-Lin, CHEN S T. A novel power planes with super-wideband elimination of ground bounce noise on high speed Circuits [J]. IEEE Microwave Wireless Components Letters, 2005, 15(3):174-176.
LU Hongmin, YU Zhiyong, ZHAO Yimin, et al. Power plan of the printed circuit board with novel electromagnetic band-gap structures [J]. Journal of Xidian University, 2011, 38(3):20-23.
KIM K H, SCHUTT-AINE J E. Analysis and modeling of hybrid planar-type electromagnetic-bandgap structures and feasibility study on power distribution network applications [J]. IEEE Transactions Microwave Theory and Techniques, 2008, 56(1):178-186.
RAO P H. Hybrid electromagnetic bandgap power plane for ultra-wideband noise suppression [J]. Electronics Letters, 2009, 45(19):981-982.
WU Tzong-Lin,WANG Ting-Kuang. Embedded power plane with ultra-wideband stop-band for simultaneously switching noise on high-speed circuits [J]. Electronics Letters, 2006, 42(4):213-214.
DING Tonghao, LI Yushan, ZHANG Wei, et al. The signal integrity analysis of electromagnetic band-gap structure [J]. Journal of Electronics Information Technology, 2010, 32(5):1267-1270.