Time Domain Macromodeling Combining with Circuit Simulation for Signal Integrity

翟小社; 王建华; 宋政湘; 耿英三

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Time Domain Macromodeling Combining with Circuit Simulation for Signal Integrity

更新时间：2025-12-08

- Time Domain Macromodeling Combining with Circuit Simulation for Signal Integrity
- Vol. 41, Issue 6, Pages: 631-635(2007)
- 作者机构：
  
  西安交通大学电力设备电气绝缘国家重点实验室,西安,710049
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN811.4
- Online First：10 June 2007，
  
  Published：2007
- 稿件说明：
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翟小社, 王建华, 宋政湘, et al. Time Domain Macromodeling Combining with Circuit Simulation for Signal Integrity[J]. 2007, 41(6): 631-635.
DOI：

翟小社, 王建华, 宋政湘, et al. Time Domain Macromodeling Combining with Circuit Simulation for Signal Integrity[J]. 2007, 41(6): 631-635. DOI：

摘要

针对电路板互连结构的信号完整性问题

为了提高仿真效率

采用了时域宏模型与电路仿真相结合的混合方法.该方法在全波电磁场(FDTD)仿真的基础上计算了互连结构的端口散射参数(S参数)

在将全波仿真结果嵌入电路仿真环境时

以矢量匹配法(VFM)结合有理函数逼近构造网络函数的宏模型

进而导出模型的等效电路.由于VFM很好地解决了随着逼近阶数的增加而出现的矩阵病态问题

同时利用同一组极点及迭代过程完成所有端口间参数的有理函数逼近

因而方便了复杂结构的分割处理与分别建模.实例分析表明

分割处理的建模时间约为整体建模的50%

同时

实例的仿真和S参数的测试对比检验了该混合方法的正确性.

Abstract

To analyze the signal integrity of interconnects on printed circuit board more efficiently

a hybrid method combining time-domain macromodeling with circuit simulation is developed. The finite-difference time-domain method(FDTD)is chosen to calculate the S-parameters on the terminals of interconnects. Embedding the above simulation results into circuit simulator

the vector fitting method(VFM)is adopted combining rational function approximation to construct the interconnect macromodel. Because VFM enables to perform the approximation with the same series of starting poles and iteration cycles steadily

it is efficient to construct the sub-models romodel respectively when dealing with complex structure

which is validated by the S-parameters measurement in the case of multi-submodel connection

and CPU time is about 50% of the consumed in the full structure simulation.

关键词

Keywords

references

Achar R, Nakhla M S. Simulation of high-speed interconnects [J]. Proceedings of the IEEE, 2001,89(5): 693-728.

Bogatin E. 信号完整性分析[M]. 李玉山,李丽平, 译. 北京:电子工业出版社, 2005.

Zhai Xiaoshe, Song Zhengxiang, Geng Yingsan, et al. Hybridized 3D-FDTD and circuit simulator for analysis of PCB via's signal integrity [C]∥2006 17th International Zurich Symposium on Electromagnetic Compatibility. Singapore: Stallion Press Ltd., 2006: 89-92.

郭裕顺. 电路分析的时频混合方法[J]. 电子学报, 2000, 28(1): 92-95.

Guo Yushun. Mixed time-frequency methods for circuit analysis [J]. Acta Electronica Sinica, 2000,28(1):92-95.

Gustavsen B, Semlyen A. Rational approximation of frequency domain responses by vector fitting [J]. IEEE Trans on Power Delivery, 1999, 14(3): 1052-1061.

李永平,储成为. Pspice电路仿真程序设计[M]. 北京: 国防工业出版社, 2006.

于学萍, 吕英华. 割裂大地对数字信号的影响[J].微波科学学报,2002,17(5):490-494.

Yu Xueping, Lü Yinghua. The effects on digital signals of slotted ground [J]. Chinese Journal of Radio Science, 2002, 17(5):490-494.

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