Using the electrical signal from the ultrasonic generator as the information carrier for detecting the bonding quality
the feature extraction method of ultrasonic electrical signal in bonding quality detection is investigated. A new feature extraction method based on the segmentation envelope is proposed for characterizing the transient ultrasonic electrical signal. According to the happening
developing and completing stages of a bonding process
the envelope of ultrasonic electrical signal is separated into three phases
namely envelope rising phase
stable phase
and damping phase. The waveform features are extracted from each phase of the envelope for further bonding quality detection. To remove the irrelevant information and reduce the dimension of original feature variables
the principal component analysis method is adopted for the feature selection
thus the data acquired from several different bonding conditions such as normal bonding
wire break bonding and peeled-off bonding are identified
and the result demonstrates the effectiveness.
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references
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