To determine the conditions for fine metallurgical bonding
a one-dimensional heat transfer model based on Stefan boundary condition was established to investigate the effects of droplets and substrate temperature on remelting. The liquid-solid interface movement and remelting depth were calculated
and the bonding of droplets in pillar component was predicted via numerical simulation. Following the simulation results
a droplet spray experiment device was designed
and some pillar components were deposited. Both experimental and simulation results demonstrate that increasing either droplet temperature or substrate temperature facilitates the bonding between deposited droplets.
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references
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