Processing of Micro-Hole by Millisecond Laser and Post Processing of Recast Layer

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Processing of Micro-Hole by Millisecond Laser and Post Processing of Recast Layer

更新时间：2025-07-09

- Processing of Micro-Hole by Millisecond Laser and Post Processing of Recast Layer
- Vol. 45, Issue 7, Pages: 45-49(2011)
- 作者机构：
  
  西安交通大学机械制造系统工程国家重点实验室,西安,710049
- 作者简介：
- 基金信息：
- DOI：
  CLC： TG665
- Online First：10 July 2011，
  
  Published：2011
- 稿件说明：
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Processing of Micro-Hole by Millisecond Laser and Post Processing of Recast Layer[J]. 2011, 45(7): 45-49.
DOI：

Processing of Micro-Hole by Millisecond Laser and Post Processing of Recast Layer[J]. 2011, 45(7): 45-49. DOI：

摘要

利用钇铝石榴石晶体(Nd:YAG)毫秒激光器以正交实验法在1Cr13不锈钢材料上进行加工实验

得出在现有条件下具有最小重铸层微小孔的脉冲激光优化参数(如脉宽、峰值功率、频率、离焦量).采用一种化学酸溶液对按此优化参数加工出来的微小孔进行腐蚀

发现腐蚀后孔壁上激光加工形成的重铸层已被完全去除

表明由脉冲激光优化参数加工出的微小孔能够很好地配合化学酸溶液的腐蚀.该复合加工方法具有成本低、效率高、操作简单的特点

不仅解决了高能束热源在金属上加工微小孔时常有重铸层及微裂纹缺陷的问题

而且得到了孔壁光滑、轮廓清晰的高质量微小孔.

Abstract

An experiment is conducted on stainless steel 1Cr13 with Nd: YAG: JK300D millisecond laser and Taguchi method. The optimized laser parameters

such as pulse width

peak power

frequency and defocus distance

are obtained in the manufacturing of microholes with the least recast layer on the present experimental conditions. Following the set of parameters

the holes form with characters that fit to be postprocessed by the present post processing technology

the holes are etched in acid solution

and eventually found that the recast layer sticking to the side wall is completely wiped off. This combined method is endowed with the advantages of low cost

high efficiency

and operation simplicity. So the defections of recast layer and micro crack due to high energy beam processing are removed to create high quality microholes.

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references

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