机器人气囊抛光SiC光学元件加工特性研究

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机器人气囊抛光SiC光学元件加工特性研究

更新时间：2025-07-09

- 机器人气囊抛光SiC光学元件加工特性研究
- Issue 12, Pages: 22-29(2020)
- 作者机构：
  
  1. 电子科技大学机械与电气工程学院
  2. 中国科学院光电技术研究所
- 作者简介：
- 基金信息：
- DOI：
  CLC： TH74;TP242
- Published：2020
- 稿件说明：
移动端阅览
[J]. 2020, (12): 22-29.
DOI：

[J]. 2020, (12): 22-29. DOI：

摘要

针对碳化硅光学元件已有的化学机械抛光、磁流变抛光、电化学抛光和催化剂辅助抛光等方式存在材料去除率低、成本高等问题

提出机器人气囊抛光方法

并对气囊抛光特性、抛光头机械结构进行了研究。首先基于Preston理论和赫兹接触理论以及速度分析建立了材料理论去除模型

并对去除函数进行了仿真

再此基础上设计了气囊抛光磨头装置。然后对非球面碳化硅元件开展了单点和多点抛光

实验验证了去除函数的精确性和稳定性。最后通过粗抛和精抛进行加工应用验证

实验结果表明

所提出方法能够有效实现碳化硅光学元件抛光

并且去除函数精度高稳定性强

通过3个周期的粗抛、4个周期的精抛

面形收敛率分别为69.4%、51.9%

且收敛速度快、加工精度高。

Abstract

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references

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