Sierpinski亲/疏水分形图案表面气泡分布及强化换热研究

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Sierpinski亲/疏水分形图案表面气泡分布及强化换热研究

更新时间：2025-07-09

- Sierpinski亲/疏水分形图案表面气泡分布及强化换热研究
- Issue 5, Pages: 100-108(2019)
- 作者机构：
  
  1. 西安交通大学化学工程与技术学院
  2. 西安交通大学苏州研究院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TK124
- Published：2019
- 稿件说明：
移动端阅览
[J]. 2019, (5): 100-108.
DOI：

[J]. 2019, (5): 100-108. DOI：

摘要

针对芯片散热表面热流具有典型的中心高四周低的非均匀分布特征

设计制备了具有三阶Sierpinski地毯曲线分形特点的亲疏水交错润湿铜表面

并通过实验观测了气泡在典型的亲/疏水分形表面的动力学特性。结果表明

气泡会首先在预设的高阶疏水点处成核、生长

并呈现典型的分形特征

实现了初始气泡成核位置的可控分布;之后

相互邻近的疏水点上的气泡开始克服能垒而发生合并

同时伴随着高阶疏水区域的气泡向中央低阶区域的定向移动、合并过程

最终在中心一阶疏水区域形成大气泡。相比于光滑及疏水点阵表面

Sierpinski亲/疏水交错润湿表面不仅能够有效降低液体起始沸腾温度

提高沸腾换热的临界热流密度

而且可以规划气泡的成核点及移动、合并方向

进而实现气泡空间分布与加热壁面热流密度分布的协同一致。因此

具有Sierpinski分形特性的亲/疏水交错润湿表面进一步提高了沸腾换热性能。

Abstract

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references

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